T2K, V93K,Integra/Micro/Ultra flex, J750, J900 series, ETS, Fusion, Delta Master, Fusion HFI, Quartet, Sapphire, Vistalogic, VistaVision.

Full size, 16 sites, 250 mil thick, 56 layers, 5500 components

High speed TMDS and RF signals.

Loopback RX/TX signals.

Operating frequency upto 25GHz.

Signal Integrity and Power Integrity Simulations

0.4mm pitch BGA

40 mil thick

EPAG Finish.

1.7”x0.4” formfactor,10 layers-ELIC

522 components, 5500 connections

287 pin BGA, 0.3mm pitch

50/85/100 Ohm Impedance requirement

Multiple EMI shields

1.1”x2”

56G high speed signals with antipads

High speed TMDS and RF signals.

S parameter extraction and 3d modeling

784 pin, 0.5mm pitch BGA

93 mil thick

Multiple FPGAs (0.3mm, 0.35mm, 0.4mm pitch.) 1724 pin, 1446 pin, 289 pin

484 56G-signals with antipads

26 Layers – 120 mil thick

SI simulations.

Controlled impedance and Relative propagation delay / length matching for all high-speed signals with tight tolerance.

60A DC current

4Oz Cu inner layers

Multiple heatsinks, thermal spokes for heat dissipation

Identify hotspots